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dc.contributor.authorUplaonkar, Anand
dc.date.accessioned2014-04-17T19:54:16Z
dc.date.available2014-04-17T19:54:16Z
dc.date.issued2005-12-01
dc.identifier.urihttps://hdl.handle.net/11244/10079
dc.description.abstractNew technique known as "Unbonded-Magnetic-Abrasive-Polishing"(UMAP) was designed and built in-house, to polish silicon-nitride balls in an economical-way. UMAP is based on the combination of underling principles of magnetic float polishing, magnetic abrasive finishing and lapping. Balls to be finished were loaded between a polishing-plate and a beveled-spindle by spring action. This was placed in a chamber mounted horizontally on a lathe, containing unbonded magnetic abrasive and non-magnetic viscous fluid. Magnetic field gradient generated around the balls concentrates abrasive particles in the polishing region. Polishing action occurs due to relative-movement of balls and abrasives between the polishing-plate and the spindle, rotating in opposite directions. A bevel of less-than 25 degree with the groove was essential for improving the sphericity and surface-finish. MRR upto 1.2 micrometer/min/ball with average sphericity of 0.77 micrometer and finish of 11.6nm were obtained. The best ball measurements achieved were 0.5 micrometer sphericity and 10.4nm finish.
dc.formatapplication/pdf
dc.languageen_US
dc.publisherOklahoma State University
dc.rightsCopyright is held by the author who has granted the Oklahoma State University Library the non-exclusive right to share this material in its institutional repository. Contact Digital Library Services at lib-dls@okstate.edu or 405-744-9161 for the permission policy on the use, reproduction or distribution of this material.
dc.titleExperimental Investigation of Unbonded Magnetic Abrasive Polishing (UMAP) of Silicon Nitride Balls
dc.typetext
osu.filenameUplaonkar_okstate_0664M_1645.pdf
osu.collegeEngineering, Architecture, and Technology
osu.accesstypeOpen Access
dc.description.departmentMechanical & Aerospace Engineering
dc.type.genreThesis


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