Intermetallic compound formation in soft solders.
| dc.contributor.author | Brothers, Everett Warner, | en_US |
| dc.date.accessioned | 2013-08-16T12:27:55Z | |
| dc.date.available | 2013-08-16T12:27:55Z | |
| dc.date.issued | 1979 | en_US |
| dc.format.extent | xxi, 191 leaves : | en_US |
| dc.identifier.uri | http://hdl.handle.net/11244/4676 | |
| dc.note | Source: Dissertation Abstracts International, Volume: 40-12, Section: B, page: 5780. | en_US |
| dc.subject | Engineering, Metallurgy. | en_US |
| dc.thesis.degree | Ph.D. | en_US |
| dc.thesis.degreeDiscipline | School of Chemical, Biological and Materials Engineering | en_US |
| dc.title | Intermetallic compound formation in soft solders. | en_US |
| dc.type | Thesis | en_US |
| ou.group | College of Engineering::School of Chemical, Biological and Materials Engineering | |
| ou.identifier | (UMI)AAI8012281 | en_US |
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