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dc.contributor.authorTheuer, Michael
dc.contributor.authorHarsha, S. Sree
dc.contributor.authorGrischkowsky, D.
dc.date.accessioned2015-10-16T20:48:17Z
dc.date.available2015-10-16T20:48:17Z
dc.date.issued2010-12-03
dc.identifierokds_Grischkowsky_JAP_2010-03-12
dc.identifier.citationTheuer, M., Harsha, S. S., & Grischkowsky, D. (2010). Flare coupled metal parallel-plate waveguides for high resolution terahertz time-domain spectroscopy. Journal of Applied Physics, 108(11), Article 113105. https://doi.org/10.1063/1.3516307
dc.identifier.urihttps://hdl.handle.net/11244/19891
dc.description.abstractWe report on a new coupling scheme for high resolution terahertz spectroscopy of microcrystalline films using parallel-plate waveguides. Metal flares are used to couple the terahertz radiation into and out of the waveguide. Very good coupling ratios as high as 35% at 1 THz from a collimated free-space beam into a subwavelength gap are obtained. This microwave approach is compared in terms of coupling ratio and spectral characteristics to the established technique of quasioptic coupling to parallel-plate waveguides using silicon lenses. Various samples at room and cryogenic temperatures are measured to show the capabilities of flare coupling for high resolution terahertz spectroscopy.
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dc.languageen_US
dc.publisherAIP Publishing
dc.rightsThis material has been previously published. In the Oklahoma State University Library's institutional repository this version is made available through the open access principles and the terms of agreement/consent between the author(s) and the publisher. The permission policy on the use, reproduction or distribution of the material falls under fair use for educational, scholarship, and research purposes. Contact Digital Resources and Discovery Services at lib-dls@okstate.edu or 405-744-9161 for further information.
dc.titleFlare coupled metal parallel-plate waveguides for high resolution terahertz time-domain spectroscopy
osu.filenameokds_Grischkowsky_JAP_2010-03-12.pdf
dc.description.peerreviewPeer reviewed
dc.identifier.doi10.1063/1.3516307
dc.description.departmentElectrical and Computer Engineering
dc.type.genreArticle
dc.type.materialText


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