dc.contributor.author | Theuer, M. | |
dc.contributor.author | Beigang, R. | |
dc.contributor.author | Grischkowsky, D. | |
dc.date.accessioned | 2015-10-16T20:48:16Z | |
dc.date.available | 2015-10-16T20:48:16Z | |
dc.date.issued | 2010-08-17 | |
dc.identifier | okds_Grischkowsky_APL_2010-17-08 | |
dc.identifier.citation | Theuer, M., Beigang, R., & Grischkowsky, D. (2010). Highly sensitive terahertz measurement of layer thickness using a two-cylinder waveguide sensor. Applied Physics Letters, 97(7), Article 071106. https://doi.org/10.1063/1.3481080 | |
dc.identifier.uri | https://hdl.handle.net/11244/19889 | |
dc.description.abstract | We report on the layer thickness determination on dielectrically coated metal cylinders using terahertz (THz) time-domain spectroscopy. A considerable sensitivity increase of up to a factor of 150 is obtained for layers down to 2.5 um thickness by introducing an experimental geometry based on a two-cylinder waveguide sensor. The layer attached on one metal cylinder is guided in contact with the second metal cylinder in the THz beam waist. This approach uses concepts of adiabatic THz wave compression and the advantages of THz waveguides. The results are compared to measurements on free-standing layers. | |
dc.format | application/pdf | |
dc.language | en_US | |
dc.publisher | AIP Publishing | |
dc.rights | This material has been previously published. In the Oklahoma State University Library's institutional repository this version is made available through the open access principles and the terms of agreement/consent between the author(s) and the publisher. The permission policy on the use, reproduction or distribution of the material falls under fair use for educational, scholarship, and research purposes. Contact Digital Resources and Discovery Services at lib-dls@okstate.edu or 405-744-9161 for further information. | |
dc.title | Highly sensitive terahertz measurement of layer thickness using a two-cylinder waveguide sensor | |
osu.filename | okds_Grischkowsky_APL_2010-17-08.pdf | |
dc.description.peerreview | Peer reviewed | |
dc.identifier.doi | 10.1063/1.3481080 | |
dc.description.department | Electrical and Computer Engineering | |
dc.type.genre | Article | |
dc.type.material | Text | |