dc.contributor.author | Coleman, S. | |
dc.contributor.author | Grischkowsky, D. | |
dc.date.accessioned | 2015-10-16T20:48:12Z | |
dc.date.available | 2015-10-16T20:48:12Z | |
dc.date.issued | 2003-11-03 | |
dc.identifier | okds_Grischkowsky_APL_2003-11-03 | |
dc.identifier.citation | Coleman, S., & Grischkowsky, D. (2003). A THz transverse electromagnetic mode two-dimensional interconnect layer incorporating quasi-optics. Applied Physics Letters, 83(18), 3656-3658. https://doi.org/10.1063/1.1624474 | |
dc.identifier.uri | https://hdl.handle.net/11244/19873 | |
dc.description.abstract | We report the demonstration of a planar THz interconnect layer capable of transmitting subpicosecond pulses in the transverse electromagnetic (TEM) mode over arbitrarily long paths with low absorption and no observable group velocity dispersion. Quasioptical elements are incorporated within the interconnect layer forming a configurable THz bandwidth TEM-mode planar interconnect with negligible group velocity dispersion and low loss. For a 146 mm guided path length, including four reflections, the pulses are broadened by the frequency dependent absorption of the interconnect layer from 0.28 to 0.32 ps, and attenuated by the factor 0.2. | |
dc.format | application/pdf | |
dc.language | en_US | |
dc.publisher | AIP Publishing | |
dc.rights | This material has been previously published. In the Oklahoma State University Library's institutional repository this version is made available through the open access principles and the terms of agreement/consent between the author(s) and the publisher. The permission policy on the use, reproduction or distribution of the material falls under fair use for educational, scholarship, and research purposes. Contact Digital Resources and Discovery Services at lib-dls@okstate.edu or 405-744-9161 for further information. | |
dc.title | THz transverse electromagnetic mode two-dimensional interconnect layer incorporating quasi-optics | |
osu.filename | okds_Grischkowsky_APL_2003-11-03.pdf | |
dc.description.peerreview | Peer reviewed | |
dc.identifier.doi | 10.1063/1.1624474 | |
dc.description.department | Electrical and Computer Engineering | |
dc.type.genre | Article | |
dc.type.material | Text | |