Browsing by Subject "material removal rate (mrr)"
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Fabrication and Testing of Apparatus for Electrochemical Mechanical Polishing (ECMP) of Copper for Semiconductor Applications
(Oklahoma State University, 2011-12-01)Electrochemical mechanical polishing (ECMP) is a process wherein the surface layer of a substrate is smoothened using a combination of electrochemical reactions, chemical reactions and mechanical forces. It is an alternative ...